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 DATA SHEET
Solid State Relay OCMOS FET
PS7341-1A,PS7341L-1A
6-PIN DIP, HIGH ISOLATION VOLTAGE 400 V BREAK DOWN VOLTAGE NORMALLY OPEN TYPE 1-ch Optical Coupled MOS FET
DESCRIPTION
The PS7341-1A and PS7341L-1A are solid state relays containing GaAs LEDs on the light emitting side (input side) and MOS FETs on the output side. They are suitable for analog signal control because of their low offset and high linearity. The PS7341L-1A has a surface mount type lead. -NEPOC Series-
FEATURES
* High isolation voltage (BV = 3 750 Vr.m.s.) * 1 channel type (1 a output) * Low LED Operating Current (IF = 2 mA) * Designed for AC/DC switching line changer * Small package (6-pin DIP) * Low offset voltage * Ordering number of taping product : PS7341L-1A-E3, E4: 1 000 pcs/reel * Pb-Free product * Safety standards * UL approved: File No. E72422 * BSI approved: No. 8252/8253 * CSA approved: No. CA 101391 * SEMKO approved: No. 606398 * DEMKO approved: No. 309836 * NEMKO approved: No. P00100964 * FIMKO approved: No. FI 15188 * DIN EN60747-5-2 (VDE0884 Part2) approved (Option)
APPLICATIONS
* Exchange equipment * Measurement equipment * FA/OA equipment
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.
Document No. PN10306EJ02V0DS (2nd edition) Date Published September 2006 NS CP(K) Printed in Japan
The mark shows major revised points.
1996, 2006
The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field.
PS7341-1A,PS7341L-1A
PACKAGE DIMENSIONS (in millimeters)
PS7341-1A
9.250.5
TOP VIEW
6 5 4
1. LED Anode 2. LED Cathode 3. NC 4. MOS FET Drain 5. MOS FET Source 6. MOS FET Drain
1
2
3
7.62 6.50.5
3.30.3 4.150.3 3.50.3
0.50.1 1.340.1 0.25 M
0 to 15 2.54
PS7341L-1A
9.250.5 6 5 4
TOP VIEW
1. LED Anode 2. LED Cathode 3. NC 4. MOS FET Drain 5. MOS FET Source 6. MOS FET Drain
1
2
3
6.50.5
3.50.3
1.340.1 0.25 M
2.54
0.90.25 9.600.4
2
Data Sheet PN10306EJ02V0DS
0.10+0.10 -0.05
PS7341-1A,PS7341L-1A

MARKING EXAMPLE
No. 1 pin Mark
PS7341-1A NL601
Country Assembled Type Number Assembly Lot
N L 6 01
Week Assembled Year Assembled (Last 1 Digit)
In-house Code (L: Pb-Free)
Rank Code
Data Sheet PN10306EJ02V0DS
3
PS7341-1A,PS7341L-1A

ORDERING INFORMATION
Part Number Order Number Solder Plating Specification PS7341-1A PS7341L-1A PS7341L-1A-E3 PS7341L-1A-E4 PS7341-1A-A PS7341L-1A-A PS7341L-1A-E3-A PS7341L-1A-E4-A Embossed Tape 1 000 pcs/reel Pb-Free Magazine case 50 pcs Packing Style Safety Standard Approval Standard products (UL, BSI, CSA, SEMKO, DEMKO, NEMKO, FIMKO approved) Application Part Number PS7341-1A
*1
*1 For the application of the Safety Standard, following part number should be used.
4
Data Sheet PN10306EJ02V0DS
PS7341-1A,PS7341L-1A
ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified)
Parameter Diode Forward Current (DC) Reverse Voltage Power Dissipation Peak Forward Current MOS FET Break Down Voltage Continuous Load Current
*2 *1
Symbol IF VR PD IFP VL Connection A Connection B Connection C IL
Ratings 50 5.0 50 1 400 150 200 300
Unit mA V mW A V mA
Pulse Load Current
*3
ILP
300
mA
(AC/DC Connection) Power Dissipation Isolation Voltage
*4
PD BV PT TA Tstg
560 3 750 610 -40 to +85 -40 to +125
mW Vr.m.s. mW C C
Total Power Dissipation Operating Ambient Temperature Storage Temperature
*1 PW = 100 s, Duty Cycle = 1% *2 Conditions: IF 2 mA. The following types of load connections are available.
1 2 3 1 2 3 1 2 3 1 2 3 6 5 4 6 5 4 6 5 4 6 5 4 IL IL L L IL + IL IL - + VL (DC) + VL (DC) - IL VL (AC/DC) L L + VL (DC) -
Connection A
IL
Connection B
Connection C
*3 PW = 100 ms, 1 shot *4 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output Pins 1-3 shorted together, 4-6 shorted together.
Data Sheet PN10306EJ02V0DS
5
PS7341-1A,PS7341L-1A
RECOMMENDED OPERATING CONDITIONS (TA = 25C)
Parameter LED Operating Current LED Off Voltage Symbol IF VF MIN. 2 0 TYP. 10 MAX. 20 0.5 Unit mA V
ELECTRICAL CHARACTERISTICS (TA = 25C)
Parameter Diode Forward Voltage Reverse Current MOS FET Off-state Leakage Current Output Capacitance Coupled LED On-state Current On-state Resistance Symbol VF IR ILoff Cout IFon Ron1 Ron2 Turn-on Time Turn-off Time
*1, 2
Conditions IF = 10 mA VR = 5 V VD = 400 V VD = 0 V, f = 1 MHz IL = 150 mA IF = 10 mA, IL = 10 mA IF = 10 mA, IL = 150 mA, t 10 ms IF = 10 mA, VO = 5 V, RL = 2 k, PW 10 ms VI-O = 1.0 kVDC V = 0 V, f = 1 MHz
MIN.
TYP. 1.2
MAX. 1.4 5.0
Unit V
A A
pF
0.03 65
1.0
2.0 20 16 0.35 0.03 10
9
mA
30 25 1.0 0.2
ton toff RI-O CI-O
ms
*1, 2
Isolation Resistance Isolation Capacitance
1.1 pF
*1 Test Circuit for Switching Time
IF Pulse Input VL
Input 50 % 0
VO = 5 V
Input monitor Rin RL
VO monitor
Output
90 %
10 % ton toff

*2 The turn-on time and turn-off time are specified as input-pulse width 10 ms. Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off time will increase.
6
Data Sheet PN10306EJ02V0DS
PS7341-1A,PS7341L-1A
TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified)
MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE
100
Maximum Forward Current IF (mA) Maximum Load Current IL (mA)
MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE
300
80
200
60
40
100
20
0 -25
0
25
50
75 85
100
0 -25
0
25
50
75 85
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
FORWARD VOLTAGE vs. AMBIENT TEMPERATURE
1.8
Output Capacitance Cout (pF)
OUTPUT CAPACITANCE vs. APPLIED VOLTAGE
200 f = 1 MHz
Forward Voltage VF (V)
1.6
1.4
IF = 50 mA 30 mA 20 mA 10 mA 5 mA 1 mA
150
100
1.2
1.0
50
0.8 -25
0
25
50
75
100
0
20
40
60
80
100
120
Ambient Temperature TA (C)
Applied Voltage VD (V)
OFF-STATE LEAKAGE CURRENT vs. APPLIED VOLTAGE
10-5
Off-state Leakage Current ILoff (A)
LOAD CURRENT vs. LOAD VOLTAGE
200 IF = 10 mA
TA = 85 C
Load Current IL (mA)
10-6
100
10-7
25 C
-4.0
-2.0 -100
0
2.0
4.0
10-8
10-9 0
100
200
300
400
500
-200 Load Voltage VL (V)
Applied Voltage VD (V)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10306EJ02V0DS
7
PS7341-1A,PS7341L-1A
NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE
3.0
ON-STATE RESISTANCE DISTRIBUTION
30 n = 50 pcs, IF = 10 mA, IL = 10 mA
Normalized On-state Resistance Ron
2.5 2.0 1.5 1.0 0.5 0.0 -25
Normalized to 1.0 at TA = 25 C, IF = 10 mA, IL = 10 mA
25
Number (pcs)
20 15 10 5 0
0
25
50
75
100
20
21
Ambient Temperature TA (C)
On-state Resistance Ron ()
TURN-ON TIME vs. FORWARD CURRENT
12 VO = 5 V 10
TURN-OFF TIME vs. FORWARD CURRENT
0.30 VO = 5 V 0.25
Turn-on Time ton (ms)
Turn-off Time toff (ms)
8 6 4 2
0.20 0.15 0.10 0.05
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Forward Current IF (mA)
Forward Current IF (mA)
TURN-ON TIME DISTRIBUTION
30 25 n = 50 pcs, IF = 10 mA, VO = 5 V 30 25
TURN-OFF TIME DISTRIBUTION
n = 50 pcs, IF = 10 mA, VO = 5 V
Number (pcs)
15 10 5 0
Number (pcs)
20
20 15 10 5 0
0.3
0.4
0.03
0.05
Turn-on Time ton (ms)
Turn-off Time toff (ms)
Remark The graphs indicate nominal characteristics.
8
Data Sheet PN10306EJ02V0DS
PS7341-1A,PS7341L-1A
NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE
3.0
Normalized Turn-on Time ton Normalized Turn-off Time toff
NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE
3.0
2.5 2.0 1.5 1.0 0.5 0.0 -25
Normalized to 1.0 at TA = 25 C, IF = 10 mA, VO = 5 V
2.5 2.0 1.5 1.0 0.5 0.0 -25
Normalized to 1.0 at TA = 25 C, IF = 10 mA, VO = 5 V
0
25
50
75
100
0
25
50
75
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10306EJ02V0DS
9
PS7341-1A,PS7341L-1A
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.00.1 4.00.1
1.5 +0.1 -0
1.750.1
4.5 MAX.
16.00.3
7.50.1
10.30.1
1.550.1 12.00.1
10.40.1 0.3
4.00.1
Tape Direction
PS7341L-1A-E3 PS7341L-1A-E4
Outline and Dimensions (Reel)
2.00.5
2.00.5 13.00.2
3302.0 1001.0
R 1.0
21.00.8
17.51.0 21.51.0
Packing: 1 000 pcs/reel
15.9 to 19.4 Outer edge of flange
10
Data Sheet PN10306EJ02V0DS
PS7341-1A,PS7341L-1A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering * Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 12030 s Two Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating)
Time (s)
(2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron * Peak temperature (lead part temperature) * Time (each pins) * Flux 350C or below 3 seconds or less Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100C.
Data Sheet PN10306EJ02V0DS
11
PS7341-1A,PS7341L-1A
(4) Cautions * To avoid quality degradation, assembling within 1 month after take this device out from covered pack is required. (Storage conditions 25C, 65%RH MAX.) * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
USAGE CAUTIONS
1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity.
12
Data Sheet PN10306EJ02V0DS
PS7341-1A,PS7341L-1A
* The information in this document is current as of September, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
M8E 02. 11-1
Data Sheet PN10306EJ02V0DS
13
PS7341-1A,PS7341L-1A
Caution
GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact NEC Compound Semiconductor Devices Hong Kong Limited E-mail: contact@ncsd-hk.necel.com Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209 NEC Electronics (Europe) GmbH http://www.eu.necel.com/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Compound Semiconductor Devices Division NEC Electronics Corporation URL: http://www.ncsd.necel.com/
0604


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